Lumistrips LED Lighting Blog

With the development of LED lighting and the high demands of consumers, LED chip manufacturers are continuously improving and innovating. The development of Chip Scale Packaged (Flip Chip or CSP) LEDs is such an inovation, with several advantages: no substrate, solderless cabling, small size and high optical density.

CSP, or Chip Scale Package, is defined as an LED package with a size equivalent to an LED chip, or no larger than 20%. The CSP product has integrated component features that do not require soldered wire connections, reducing thermal resistance, reducing the heat transfer path, and reducing potential sources of error.

Usually, a light emitting diode (LED) has two key components, the LED chip that emits the light and the LED package which focuses it, enables assembly into lighting products and transfers the heat away to the heat sink.

Optisolis LEDs from Nichia have the full spectrum of sunlight

The latest innovation from world market leader Nichia in LED development is the Optisolis technology. The full-spectrum Optisolis LEDs NF2W757G-F1 and NF2L757G-F1 LEDs are capable of generating a light spectrum that comes closest to that of the sun. 

The Optisolis LEDs are Ultra-High CRI light sources, with almost maximum scores for all 16 of the color samples that are used in the color rendering index metric. The 5000K Nichia NF2L757G-F1 Optisolis LED can achieve a Ra of 99 out of 100 and equaliy high IES TM-30-15 scores, of Rf 98 and Rg at 99.